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1 Ergebnisse
1
Experimental and Numerical Investigation of Cu-Cu Direct Bo..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Oh, Sung-Hyun
;
Lee, Hyun-Dong
;
Lee, Jae-Uk
... - p. 1628-1632 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00268
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Experimental and Numerical Investigation of Cu-Cu Direct Bonding Quality for 3D Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564989&Exemplar=1&LAN=DE A1 Oh, Sung-Hyun A1 Lee, Hyun-Dong A1 Lee, Jae-Uk A1 Park, Sung-Ho A1 Cho, Won-Seob A1 Park, Yong-Jin A1 Haag, Alexandra A1 Watanabe, Soichi A1 Arnold, Marco A1 Lee, Hoo-Jeong A1 Lee, Eun-Ho YR 2024 SN 2377-5726 K1 Temperature measurement K1 Deformation K1 Surface morphology K1 Surface roughness K1 Rough surfaces K1 Plastics K1 Bonding K1 Cu-Cu bonding K1 pressure effect K1 temperature effect K1 thermal-mechanical analysis K1 void formation SP 1628 OP 1632 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00268 DO https://doi.org/10.1109/ECTC51529.2024.00268 SF ELIB - SuUB Bremen
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