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1 Ergebnisse
1
Effect of (111) Surface Ratio on the Bonding Quality of Cu-..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Huang, Jian-Yuan
;
Chen, Chih
- p. 626-630 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00104
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
Effect of (111) Surface Ratio on the Bonding Quality of Cu-Cu Joints
UL https://suche.suub.uni-bremen.de/peid=ieee-10564991&Exemplar=1&LAN=DE A1 Huang, Jian-Yuan A1 Chen, Chih YR 2024 SN 2377-5726 K1 Grain size K1 Correlation K1 Three-dimensional displays K1 Films K1 Surface roughness K1 Silicon K1 Rough surfaces K1 advanced packaging K1 Cu-Cu bonding K1 nanotwinned Cu K1 Surface (111) ratio K1 shear strength SP 626 OP 630 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00104 DO https://doi.org/10.1109/ECTC51529.2024.00104 SF ELIB - SuUB Bremen
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