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1 Ergebnisse
1
Develop new solder alloy for high reliability device:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Wu, Albert T.
;
Tseng, Watson
;
Wang, Chang-Meng
. - p. 1144-1147 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00184
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
Develop new solder alloy for high reliability device
UL https://suche.suub.uni-bremen.de/peid=ieee-10564998&Exemplar=1&LAN=DE A1 Wu, Albert T. A1 Tseng, Watson A1 Wang, Chang-Meng A1 Lin, Wei-Ting YR 2024 SN 2377-5726 K1 Thermal resistance K1 Materials reliability K1 Automotive electronics K1 Aging K1 Fatigue K1 Reliability K1 Intermetallic K1 solder joint K1 high reliability K1 TCT K1 drop test K1 thermal fatigue SP 1144 OP 1147 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00184 DO https://doi.org/10.1109/ECTC51529.2024.00184 SF ELIB - SuUB Bremen
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