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1 Ergebnisse
1
Signal, Power and Thermal Co-optimization Methodology for F..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Liu, Wei
;
Chen, Guang
;
Wang, Brian
.. - p. 1085-1092 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00174
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Signal, Power and Thermal Co-optimization Methodology for FPGA Advanced Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564999&Exemplar=1&LAN=DE A1 Liu, Wei A1 Chen, Guang A1 Wang, Brian A1 Jiang, Jenny Xiaohong A1 Milligan, Ed YR 2024 SN 2377-5726 K1 Rails K1 Temperature distribution K1 Noise K1 Voltage K1 Electronic packaging thermal management K1 Routing K1 Artificial intelligence K1 signal integrity K1 power integrity K1 power delivery network K1 artificial intelligence K1 FPGA core power SP 1085 OP 1092 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00174 DO https://doi.org/10.1109/ECTC51529.2024.00174 SF ELIB - SuUB Bremen
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