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1 Ergebnisse
1
A Warpage Investigation for a Large Panel-sized Interposer ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
To, Katsuaki
;
Minami, Masashi
;
Yamanaka, Daisuke
... - p. 1900-1904 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00321
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
A Warpage Investigation for a Large Panel-sized Interposer with Embedded Dies
UL https://suche.suub.uni-bremen.de/peid=ieee-10565005&Exemplar=1&LAN=DE A1 To, Katsuaki A1 Minami, Masashi A1 Yamanaka, Daisuke A1 Tsai, Shan Ho A1 Iseki, Takahiro A1 Katoh, Sadaaki YR 2024 SN 2377-5726 K1 Wiring K1 Fabrication K1 Thermal expansion K1 Semiconductor device measurement K1 Shape K1 Process control K1 Glass K1 2.xD semiconductor packages K1 organic interposer K1 panel level interposer K1 fine wirings K1 warpage K1 embedded dies SP 1900 OP 1904 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00321 DO https://doi.org/10.1109/ECTC51529.2024.00321 SF ELIB - SuUB Bremen
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