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1 Ergebnisse
1
Finite Element Modeling for Wafer-to-Wafer Direct Bonding B..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Baek, Kyungmin
;
Han, Min-soo
;
Han, Il Young
... - p. 1256-1259 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00203
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565012&Exemplar=1&LAN=DE A1 Baek, Kyungmin A1 Han, Min-soo A1 Han, Il Young A1 Shin Lee, Jung A1 Sim, Jaeuk A1 Lee, Joongha A1 Min, Daeho A1 Lim, Kyeongbin A1 Rhee, Minwoo Daniel YR 2024 SN 2377-5726 K1 Semiconductor device modeling K1 Three-dimensional displays K1 Atmospheric modeling K1 Aerodynamics K1 Numerical simulation K1 Numerical models K1 Pins K1 wafer-to-wafer direct bonding K1 bonding alignment K1 finite element modeling and analysis SP 1256 OP 1259 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00203 DO https://doi.org/10.1109/ECTC51529.2024.00203 SF ELIB - SuUB Bremen
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