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1 Ergebnisse
1
Experimentally Validated Thermal Modeling Prediction for BE..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Chang, Xinyue
;
Oprins, Herman
;
Vermeersch, Bjorn
... - p. 498-505 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00084
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565013&Exemplar=1&LAN=DE A1 Chang, Xinyue A1 Oprins, Herman A1 Vermeersch, Bjorn A1 Cherman, Vladimir A1 Lofrano, Melina A1 Park, Seongho A1 Tokei, Zsolt A1 De Wolf, Ingrid YR 2024 SN 2377-5726 K1 Analytical models K1 Thermal resistance K1 Metals K1 Predictive models K1 Thermal conductivity K1 Electronic packaging thermal management K1 Thermal analysis K1 BEOL K1 BSPDN K1 out-of-plane thermal resistance K1 multi-scale thermal modeling K1 prediction K1 experimental characterization SP 498 OP 505 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00084 DO https://doi.org/10.1109/ECTC51529.2024.00084 SF ELIB - SuUB Bremen
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