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1 Ergebnisse
1
Board Level Drop Reliability of Hybrid Solder Joints with C..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kim, Seahwan
;
Min, Kyung Deuk
;
Jun Yoon, Jae
.. - p. 1473-1478 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00239
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Board Level Drop Reliability of Hybrid Solder Joints with Controlled Bismuth Mixing Ratio for Carbon Neutrality</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565016&Exemplar=1&LAN=DE A1 Kim, Seahwan A1 Min, Kyung Deuk A1 Jun Yoon, Jae A1 Noh, Taejoon A1 Jung, Seung-Boo YR 2024 SN 2377-5726 K1 Resistance K1 Ball grid arrays K1 Shape K1 Electric shock K1 Reliability engineering K1 Electronic packaging thermal management K1 Temperature control K1 Hybrid ball grid array solder joints K1 bismuth mixing ratio K1 drop reliability K1 double-sided Bi diffusion SP 1473 OP 1478 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00239 DO https://doi.org/10.1109/ECTC51529.2024.00239 SF ELIB - SuUB Bremen
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