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1 Ergebnisse
1
Novel sheet molding compound technology for wafer-level pac..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Sugiura, Yuki
;
Mori, Daisuke
;
Fujii, Yasuhito
... - p. 855-859 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00137
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Novel sheet molding compound technology for wafer-level packaging to overcome wafer warpage issue</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565017&Exemplar=1&LAN=DE A1 Sugiura, Yuki A1 Mori, Daisuke A1 Fujii, Yasuhito A1 Imamura, Kenta A1 Yamai, Ippei A1 Yagihashi, Takashi A1 Nomura, Eiichi YR 2024 SN 2377-5726 K1 Thermal expansion K1 Liquids K1 Electronic components K1 Packaging K1 Wafer scale integration K1 Compounds K1 History K1 compression molding K1 film molding compound K1 flow mark K1 sheet molding compound K1 SMC K1 wafer level packaging K1 warpage control SP 855 OP 859 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00137 DO https://doi.org/10.1109/ECTC51529.2024.00137 SF ELIB - SuUB Bremen
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