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1 Ergebnisse
1
A study about direct laser reflow for forming stable and re..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Fettke, Matthias
;
Fisch, Anne
;
Geschke, Tom
... - p. 1298-1305 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00211
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565023&Exemplar=1&LAN=DE A1 Fettke, Matthias A1 Fisch, Anne A1 Geschke, Tom A1 Frick, Alexander A1 Alyasin, Khaled A1 Teutsch, Thorsten YR 2024 SN 2377-5726 K1 Optical fibers K1 Optical fiber sensors K1 Scanning electron microscopy K1 Optical feedback K1 X-ray lasers K1 Laser feedback K1 Optical reflection K1 laser reflow K1 laser bonding K1 LAB K1 LAR K1 LCB K1 solder bump K1 solder joint K1 C4 SP 1298 OP 1305 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00211 DO https://doi.org/10.1109/ECTC51529.2024.00211 SF ELIB - SuUB Bremen
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