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1 Ergebnisse
1
Glass Panel Process Integrated Low Stress Organic Dielectri..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Hsiung, Chien-Kang
;
Wang, Terry
;
Wozny, Sarah
.. - p. 1896-1899 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00320
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565024&Exemplar=1&LAN=DE A1 Hsiung, Chien-Kang A1 Wang, Terry A1 Wozny, Sarah A1 Bernt, Marvin L A1 Chen, Kuan-Nang YR 2024 SN 2377-5726 K1 Temperature sensors K1 Temperature measurement K1 Electronic components K1 Glass K1 Dielectrics K1 Bonding K1 Stress K1 RDL K1 HBI K1 PLP K1 Low Temperature Cu-Cu Bonding SP 1896 OP 1899 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00320 DO https://doi.org/10.1109/ECTC51529.2024.00320 SF ELIB - SuUB Bremen
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