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1 Ergebnisse
1
Prediction of Moisture Absorption Characteristics under Nor..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Noh, Hyunggyun
;
Bae, Jinsoo
;
Rhew, Keunho
... - p. 254-258 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00048
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Prediction of Moisture Absorption Characteristics under Normal/Accelerated Preconditioning Condition in Multi Chip Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565025&Exemplar=1&LAN=DE A1 Noh, Hyunggyun A1 Bae, Jinsoo A1 Rhew, Keunho A1 Yoo, Soojin A1 Lim, Jiyoung A1 Hwang, Yuchul A1 Pae, Sangwoo YR 2024 SN 2377-5726 K1 Absorption K1 Deformation K1 Moisture K1 Electronic components K1 Numerical simulation K1 Reliability K1 Delamination K1 Moisture absorption K1 Preconditioning K1 Accelerated condition K1 Hygroscopic stress K1 Multi chip packages SP 254 OP 258 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00048 DO https://doi.org/10.1109/ECTC51529.2024.00048 SF ELIB - SuUB Bremen
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