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1 Ergebnisse
1
A Novel Detection Applied on Micro Defect in Bump Interface..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lin, Yi-Sheng
;
Hsiao, Yu-Hsiang
;
Liu, Cheng-Hsin
... - p. 1804-1807 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00301
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Novel Detection Applied on Micro Defect in Bump Interface for 2.5DIC Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565027&Exemplar=1&LAN=DE A1 Lin, Yi-Sheng A1 Hsiao, Yu-Hsiang A1 Liu, Cheng-Hsin A1 Hsiao, Fan-Ju A1 Wang, Chen-Chao A1 Hung, Chin-Pin YR 2024 SN 2377-5726 K1 Sensitivity K1 Adhesives K1 Failure analysis K1 Plating K1 Silicon K1 Electrical resistance measurement K1 Artificial intelligence K1 2.5D IC K1 Micro defect K1 Failure analysis procedure K1 Interface K1 Electroplating SP 1804 OP 1807 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00301 DO https://doi.org/10.1109/ECTC51529.2024.00301 SF ELIB - SuUB Bremen
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