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1 Ergebnisse
1
Analysis of vacancies in wafer-bonding interface via positr..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Saito, Sotetsu
;
Fujii, Nobutoshi
;
Furuse, Shunsuke
... - p. 1916-1922 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00324
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Analysis of vacancies in wafer-bonding interface via positron annihilation lifetime spectroscopy</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565035&Exemplar=1&LAN=DE A1 Saito, Sotetsu A1 Fujii, Nobutoshi A1 Furuse, Shunsuke A1 Ogawa, Naoki A1 Saito, Suguru A1 Hagimoto, Yoshiya A1 Iwamoto, Hayato YR 2024 SN 2377-5726 K1 Spectroscopy K1 Thermal expansion K1 Sensitivity K1 Atmospheric measurements K1 Films K1 Moisture K1 Positrons K1 wafer-to-wafer bonding K1 bonding strength SP 1916 OP 1922 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00324 DO https://doi.org/10.1109/ECTC51529.2024.00324 SF ELIB - SuUB Bremen
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