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1 Ergebnisse
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Dry processes to form fine features on advanced substrates:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Xiao, Wen
;
Mora, Cindy
;
Loo, Nicholas
... - p. 523-526 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00088
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Dry processes to form fine features on advanced substrates</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565039&Exemplar=1&LAN=DE A1 Xiao, Wen A1 Mora, Cindy A1 Loo, Nicholas A1 Zhong, Qin A1 Chunder, Anindarupa A1 Qing, Weihua A1 Chi, Sik Hin A1 Sun, Cheng A1 Li, Carl A1 Rosslee, Craig A1 Penmethsa, Harish V A1 Turner, Jeff YR 2024 SN 2377-5726 K1 Wet etching K1 Metallization K1 Semiconductor lasers K1 Lithography K1 Resists K1 Production K1 Throughput K1 via and trench formation K1 patterning K1 dry plasma process K1 heterogeneous materials SP 523 OP 526 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00088 DO https://doi.org/10.1109/ECTC51529.2024.00088 SF ELIB - SuUB Bremen
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