I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Chiu, Wei-Lan
;
Lee, Ou-Hsiang
;
Chang, Hsiang-Hung
... - p. 319-324 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00059
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned Cu and SiCN-to-SiO2 Wafer-to-Wafer Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565040&Exemplar=1&LAN=DE A1 Chiu, Wei-Lan A1 Lee, Ou-Hsiang A1 Chang, Hsiang-Hung A1 Lo, James Yi-Jen A1 Shih, Chiang-Lin A1 Chiu, Hsih-Yang A1 Wang, Chin-Hung A1 Lo, Wei-Chung YR 2024 SN 2377-5726 K1 Manufacturing processes K1 Ovens K1 Semiconductor device reliability K1 Bandwidth K1 Packaging K1 Surface roughness K1 System-on-chip K1 nanocrystalline nanotwinned copper K1 NNT-Cu K1 fine pitch K1 SiCN-to-SiO2 K1 low-temperature bonding K1 wafer-to-wafer K1 hybrid bonding SP 319 OP 324 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00059 DO https://doi.org/10.1109/ECTC51529.2024.00059 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
