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1 Ergebnisse
1
Design and Fabrication of 2.5D Cryogenic Interposer With In..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Li, HongYu
;
Chui, King-Jien
;
Kiat Goh, Simon Chun
... - p. 458-463 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00078
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Design and Fabrication of 2.5D Cryogenic Interposer With Integrated Superconducting TSVs and Resonators</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565042&Exemplar=1&LAN=DE A1 Li, HongYu A1 Chui, King-Jien A1 Kiat Goh, Simon Chun A1 Perdana Budoyo, Rangga A1 Long, Nguyen Hoang A1 Chyn Ng, Yong A1 Lau, Daniel A1 Jaafar, B. N. A1 Paul Tan, Yuanzheng A1 Dumke, Rainer YR 2024 SN 2377-5726 K1 Fabrication K1 Power transmission lines K1 Superconducting transmission lines K1 Resonant frequency K1 Electronic components K1 Cryogenics K1 Microwave theory and techniques K1 2.5D cryogenic interposer K1 Tc of the interposer K1 Transmission at cryogenic temperature K1 resonators SP 458 OP 463 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00078 DO https://doi.org/10.1109/ECTC51529.2024.00078 SF ELIB - SuUB Bremen
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