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1 Ergebnisse
1
Mitigating Cracking from RDL Stress in Glass Substrates wit..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Molina-Mangual, Christian
;
Surillo, Emanuel Torres
;
Nedumthakady, Nithin
. - p. 1552-1557 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00253
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Mitigating Cracking from RDL Stress in Glass Substrates with Low-CTE Electrodeposited Copper-Graphene Composites</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565043&Exemplar=1&LAN=DE A1 Molina-Mangual, Christian A1 Surillo, Emanuel Torres A1 Nedumthakady, Nithin A1 Smet, Vanessa YR 2024 SN 2377-5726 K1 Thermal expansion K1 Scalability K1 Magnetic cores K1 Graphene K1 Glass K1 Materials reliability K1 Electronic packaging thermal management K1 Electrodeposited copper-graphene composites K1 glass-based packaging K1 fracture mechanics K1 finite-element methods K1 free-edge effect SP 1552 OP 1557 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00253 DO https://doi.org/10.1109/ECTC51529.2024.00253 SF ELIB - SuUB Bremen
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