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1 Ergebnisse
1
A Novel Approach to Assess Board Level Solder Joint Reliabi..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Li, Guangxu
;
Gurrum, Siva P.
;
Mortan, Frank
.. - p. 229-233 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00270
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Novel Approach to Assess Board Level Solder Joint Reliability for Flip-Chip on Leadframe Package Using Finite Element Analysis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565059&Exemplar=1&LAN=DE A1 Li, Guangxu A1 Gurrum, Siva P. A1 Mortan, Frank A1 Jiang, Li A1 Arroyo, Carlos YR 2024 SN 2377-5726 K1 Semiconductor device modeling K1 Industries K1 Geometry K1 Correlation K1 Shape K1 Lead K1 Reliability engineering K1 Flip Chip on Lead QFN K1 Board Level Solder Joint Reliability K1 1st Failure Cycle K1 Finite Element Analysis SP 229 OP 233 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00270 DO https://doi.org/10.1109/ECTC51529.2024.00270 SF ELIB - SuUB Bremen
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