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1 Ergebnisse
1
Process Development of Manifold Microchannels Cooling for E..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Yang, Zhou
;
Yang, Yuchi
;
Lyu, Peijue
... - p. 2280-2285 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00387
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Process Development of Manifold Microchannels Cooling for Embedded Silicon Fan-Out (MMC-eSiFO) Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565064&Exemplar=1&LAN=DE A1 Yang, Zhou A1 Yang, Yuchi A1 Lyu, Peijue A1 Du, Jianyu A1 Chen, Lang A1 Kang, Jin A1 Bu, Weihai A1 Zheng, Kai A1 Zhou, Yikang A1 Zhang, Chi A1 Wang, Wei YR 2024 SN 2377-5726 K1 Manifolds K1 Fabrication K1 Wafer bonding K1 Three-dimensional displays K1 Cooling K1 Packaging K1 Silicon K1 MMC-eSiFO K1 3D interlayer liquid cooling K1 Chiplet customized cooling K1 Channel-middle process SP 2280 OP 2285 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00387 DO https://doi.org/10.1109/ECTC51529.2024.00387 SF ELIB - SuUB Bremen
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