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1 Ergebnisse
1
How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Braun, Tanja
;
Holck, Ole
;
Adler, Marius
... - p. 1-6 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00008
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565068&Exemplar=1&LAN=DE A1 Braun, Tanja A1 Holck, Ole A1 Adler, Marius A1 Obst, Mattis A1 Voges, Steve A1 Becker, Karl-Friedrich A1 Aschenbrenner, Rolf A1 Voitel, Marcus A1 Dreissigacker, Marc A1 Schneider-Ramelow, Martin YR 2024 SN 2377-5726 K1 Shape K1 Sociology K1 Semiconductor device reliability K1 Process control K1 Packaging K1 Curing K1 Market research K1 fan-out wafer level packaging K1 panel level packaging K1 warpage SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00008 DO https://doi.org/10.1109/ECTC51529.2024.00008 SF ELIB - SuUB Bremen
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