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1 Ergebnisse
1
Micro-3D-Printed Packaging Substrates With Embedded Through..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kim, Nahyeon
;
Jung, Haksoon
;
Lee, Yongwoo
... - p. 710-714 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00115
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Micro-3D-Printed Packaging Substrates With Embedded Through Holes for Organic Interposers</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565076&Exemplar=1&LAN=DE A1 Kim, Nahyeon A1 Jung, Haksoon A1 Lee, Yongwoo A1 Eum, Sungmin A1 Han, Yechan A1 Park, Hyunjin A1 Park, Yunsik A1 Kwon, Jimin YR 2024 SN 2377-5726 K1 Geometry K1 Fabrication K1 Thermal expansion K1 Three-dimensional displays K1 Packaging K1 Plating K1 Three-dimensional printing K1 additive manufacturing K1 3D printing K1 packaging substrate K1 through hole SP 710 OP 714 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00115 DO https://doi.org/10.1109/ECTC51529.2024.00115 SF ELIB - SuUB Bremen
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