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1 Ergebnisse
1
High-Throughput Characterization of Nanoscale Topography fo..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lee, Bongsub
;
Zhao, Oliver
;
Avellan, Arianna
... - p. 969-975 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00157
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565083&Exemplar=1&LAN=DE A1 Lee, Bongsub A1 Zhao, Oliver A1 Avellan, Arianna A1 Sadiq, Suhail A1 Fountain, Gill A1 Suwito, Dominik A1 Gao, Guilian A1 Mirkarimi, Laura YR 2024 SN 2377-5726 K1 Silicon compounds K1 Optical interferometry K1 Surface contamination K1 Metals K1 Process control K1 Surfaces K1 Throughput K1 hybrid bonding K1 nanoscale metrology K1 nanoscale topography K1 phase shift interferometry K1 atomic force microscopy SP 969 OP 975 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00157 DO https://doi.org/10.1109/ECTC51529.2024.00157 SF ELIB - SuUB Bremen
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