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Thermal Performance of an Indium-Silver Alloy Metal TIM for..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kim, SangHyuk
;
Sohn, EunSook
;
Kweon, YoungDo
. - p. 1498-1503 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00243
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Thermal Performance of an Indium-Silver Alloy Metal TIM for a Large Body Lidded FCBGA After EOL and Long-term Reliability Tests</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565084&Exemplar=1&LAN=DE A1 Kim, SangHyuk A1 Sohn, EunSook A1 Kweon, YoungDo A1 Park, KyungRok YR 2024 SN 2377-5726 K1 Temperature measurement K1 Semiconductor device measurement K1 High-temperature superconductors K1 Three-dimensional displays K1 Metals K1 Thermal conductivity K1 Acoustic measurements K1 FCBGA K1 Theta JC K1 Metal TIM SP 1498 OP 1503 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00243 DO https://doi.org/10.1109/ECTC51529.2024.00243 SF ELIB - SuUB Bremen
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