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1 Ergebnisse
1
Electrical Characterization and Reliability Studies of Nano..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Tseng, Ya-Ching
;
Chui, King-Jien
;
Goh, Simon Chun Kiat
... - p. 1581-1586 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00258
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
Electrical Characterization and Reliability Studies of Nano-TSV
UL https://suche.suub.uni-bremen.de/peid=ieee-10565087&Exemplar=1&LAN=DE A1 Tseng, Ya-Ching A1 Chui, King-Jien A1 Goh, Simon Chun Kiat A1 Lau, Daniel A1 Li, Hongyu A1 Anh, Tran Van Nhat A1 Yu, Haitao A1 Tew, Chin Khang A1 Chen, Gim Guan A1 Varghese, Binni A1 Ming, Calvin Chua Hung YR 2024 SN 2377-5726 K1 Resistance K1 Semiconductor device reliability K1 Silicon-on-insulator K1 Plating K1 Insulators K1 Silicon K1 Power system reliability K1 nano-TSV K1 backside power delivery network K1 electrical characterization K1 reliability study SP 1581 OP 1586 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00258 DO https://doi.org/10.1109/ECTC51529.2024.00258 SF ELIB - SuUB Bremen
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