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1 Ergebnisse
1
Reliability of Indium Solder Joints using a Laser-Assisted ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Jung, Ji Eun
;
Eom, Yong-Sung
;
Joo, Jiho
... - p. 2237-2243 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00380
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Reliability of Indium Solder Joints using a Laser-Assisted Bonding (LAB) Process at Room Temperature</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565088&Exemplar=1&LAN=DE A1 Jung, Ji Eun A1 Eom, Yong-Sung A1 Joo, Jiho A1 Choi, Gwang-Mun A1 Shin, Jung-Ho A1 Lee, Chanmi A1 Jang, Ki-Seok A1 Oh, Jin-Hyuk A1 Lee, Ga Eun A1 Choi, Kwang-Seong A1 Lee, Seung-Yoon YR 2024 SN 2377-5726 K1 Resistance K1 Heating systems K1 Radiation effects K1 Scanning electron microscopy K1 Contact resistance K1 Indium K1 Reliability K1 Indium solder K1 Laser-assisted Bonding(LAB) K1 Laser Epoxy Paste K1 Microstructure K1 Process Window K1 Low-carbon process SP 2237 OP 2243 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00380 DO https://doi.org/10.1109/ECTC51529.2024.00380 SF ELIB - SuUB Bremen
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