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1 Ergebnisse
1
Study of Ultra-Fine 0.4 μm Pitch Wafer-to-Wafer Hybrid Bond..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Ikegami, Yukako
;
Onodera, Takumi
;
Chiyozono, Masanori
... - p. 299-304 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00056
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Study of Ultra-Fine 0.4 μm Pitch Wafer-to-Wafer Hybrid Bonding and Impact of Bonding Misalignment</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565092&Exemplar=1&LAN=DE A1 Ikegami, Yukako A1 Onodera, Takumi A1 Chiyozono, Masanori A1 Sakamoto, Akihisa A1 Shimizu, Kan A1 Kagawa, Yoshihisa A1 Iwamoto, Hayato YR 2024 SN 2377-5726 K1 Resistance K1 Correlation K1 Semiconductor device reliability K1 Linearity K1 Electronic components K1 Contact resistance K1 Bonding K1 Cu–Cu hybrid bonding K1 wafer level bonding K1 misalignment K1 fine pitch K1 electromigration K1 stress migration K1 face-to-face bonding K1 WoW SP 299 OP 304 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00056 DO https://doi.org/10.1109/ECTC51529.2024.00056 SF ELIB - SuUB Bremen
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