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1 Ergebnisse
1
Wideband Antennas on Thin-Film Packaging Substrates for 140..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Le, Thi Huyen
;
Kaiser, Michael Philipp
;
Koezegi, Julia-Marie
... - p. 732-737 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00119
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Wideband Antennas on Thin-Film Packaging Substrates for 140 GHz 6G Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565093&Exemplar=1&LAN=DE A1 Le, Thi Huyen A1 Kaiser, Michael Philipp A1 Koezegi, Julia-Marie A1 Murugesan, Kavin Senthil A1 Gerhold, Lutz A1 Hichri, Habib A1 Oishi, Ryohei A1 Nakano, Reki A1 Ndip, Ivan A1 Schneider-Ramelow, Martin YR 2024 SN 2377-5726 K1 Antenna measurements K1 6G mobile communication K1 Patch antennas K1 Packaging K1 Loss measurement K1 Broadband antennas K1 Substrates K1 wideband antennas K1 6G antennas K1 D-Band K1 thin-film K1 packaging substrate SP 732 OP 737 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00119 DO https://doi.org/10.1109/ECTC51529.2024.00119 SF ELIB - SuUB Bremen
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