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1 Ergebnisse
1
Mitigating Solder Beading in Non-Eutectic Low-Temperature S..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Teng, Saw Lip
;
Devarajan, Mutharasu
;
Nadarajah, Puurnaraj A-L
. - p. 1131-1136 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00182
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Mitigating Solder Beading in Non-Eutectic Low-Temperature Solder: Mechanism and Solution</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565094&Exemplar=1&LAN=DE A1 Teng, Saw Lip A1 Devarajan, Mutharasu A1 Nadarajah, Puurnaraj A-L A1 Yang Soo, Chye YR 2024 SN 2377-5726 K1 Surface cleaning K1 Printing K1 Three-dimensional displays K1 Shape K1 Metals K1 Surfaces K1 Minimization K1 low-temperature solder K1 non-eutectic K1 solder beading SP 1131 OP 1136 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00182 DO https://doi.org/10.1109/ECTC51529.2024.00182 SF ELIB - SuUB Bremen
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