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1 Ergebnisse
1
Development of Glass core substrate with the stress analysi..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Fujimoto, Koji
;
Okawa, Yashuhiro
;
Tai, Takahiro
. - p. 546-550 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00093
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Development of Glass core substrate with the stress analysis, transmission characteristics and reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565095&Exemplar=1&LAN=DE A1 Fujimoto, Koji A1 Okawa, Yashuhiro A1 Tai, Takahiro A1 Kuramochi, Satoru YR 2024 SN 2377-5726 K1 Glass K1 Thermal conductivity K1 Propagation losses K1 Filling K1 Thermal analysis K1 Reliability K1 High frequency K1 glass core K1 chiplet K1 TGV K1 GIP K1 via shape K1 thermal stress K1 thermal cycle K1 reliability K1 transmission loss SP 546 OP 550 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00093 DO https://doi.org/10.1109/ECTC51529.2024.00093 SF ELIB - SuUB Bremen
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