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1 Ergebnisse
1
Innovative Two-Phase Immersion Cooling Solutions for high-p..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Sharma, Sumit
;
Ahmad, Aqbal
;
Huang, ICheng
... - p. 1515-1515 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00246
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Innovative Two-Phase Immersion Cooling Solutions for high-power Advanced Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565096&Exemplar=1&LAN=DE A1 Sharma, Sumit A1 Ahmad, Aqbal A1 Huang, ICheng A1 Lu, Ying-Xu A1 Huang, Hung-Hsien A1 Wang, Chen-Chao A1 Hung, Chih-Pin A1 Wang, Chi-Chuan YR 2024 SN 2377-5726 K1 Heat pipes K1 Immersion cooling K1 Electronic packaging thermal management K1 Boilers K1 Numerical models K1 Copper K1 Thermal loading K1 two-phase immersion cooling K1 HPC Packages K1 boiling enhancement K1 heat pipe K1 heat spreader K1 CFD SP 1515 OP 1515 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00246 DO https://doi.org/10.1109/ECTC51529.2024.00246 SF ELIB - SuUB Bremen
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