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1 Ergebnisse
1
Next Generation Large Size High Interconnect Density CoWoS-..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lee, Chien-Hsun
;
Hu, YH
;
Chen, SM
... - p. 259-263 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00049
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
Next Generation Large Size High Interconnect Density CoWoS-R Package
UL https://suche.suub.uni-bremen.de/peid=ieee-10565097&Exemplar=1&LAN=DE A1 Lee, Chien-Hsun A1 Hu, YH A1 Chen, SM A1 Lai, CL A1 Liu, M A1 Chen, HY A1 Lin, J A1 Yew, MC A1 Hsu, CK A1 Chiu, MY A1 Chen, CH A1 Chou, MW A1 Chen, WC A1 Chang, J A1 Hsieh, C.C. A1 Chen, CS A1 Chen, HW A1 Wang, CT A1 Yan, Kathy A1 Jeng, Shin-Puu A1 He, Jun YR 2024 SN 2377-5726 K1 Scalability K1 Noise K1 Capacitors K1 Bandwidth K1 Production K1 Reliability K1 Servers K1 CoWoS-R K1 Organic interposer K1 heterogeneous integration K1 large package K1 HBM K1 signal integrity SP 259 OP 263 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00049 DO https://doi.org/10.1109/ECTC51529.2024.00049 SF ELIB - SuUB Bremen
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