I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Aluminum to copper thermal compression bonding for heteroge..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Sahoo, Krutikesh
;
Harish, Vineeth
;
Liu, Jui-Han
... - p. 1940-1946 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00329
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565098&Exemplar=1&LAN=DE A1 Sahoo, Krutikesh A1 Harish, Vineeth A1 Liu, Jui-Han A1 Irwin, Randall A1 Yang, Cheng-Ting Michael A1 Sun, Henry A1 Iyer, Subramanian S. YR 2024 SN 2377-5726 K1 Thermal expansion K1 Thermal resistance K1 Aluminum K1 Silicon K1 Electrical resistance measurement K1 Bonding K1 Probes K1 thermal compression bonding K1 silicon interconnect fabric K1 aluminum K1 copper K1 advanced packaging K1 heterogeneous integration SP 1940 OP 1946 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00329 DO https://doi.org/10.1109/ECTC51529.2024.00329 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
