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1 Ergebnisse
1
A predictive methodology for BGA solder joint formation and..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Bond, Matt
;
Ahmad, Mudasir
;
Teng, Sue
... - p. 1558-1563 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00254
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
A predictive methodology for BGA solder joint formation and assembly defects
UL https://suche.suub.uni-bremen.de/peid=ieee-10565100&Exemplar=1&LAN=DE A1 Bond, Matt A1 Ahmad, Mudasir A1 Teng, Sue A1 Shahidi, Nima A1 Kim, Jin A1 Tang, Yingshi YR 2024 SN 2377-5726 K1 Solid modeling K1 Shape K1 Predictive models K1 Packaging K1 Risk management K1 Reliability K1 Soldering K1 solder joint K1 defects K1 warpage K1 SMT K1 HIP K1 bridge SP 1558 OP 1563 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00254 DO https://doi.org/10.1109/ECTC51529.2024.00254 SF ELIB - SuUB Bremen
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