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1 Ergebnisse
1
A Study on Novel Low Temperature Soldering Process using Va..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kim, Youngja
;
Choi, Woojin
;
Oh, Seungyeop
.. - p. 2091-2095 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00356
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Study on Novel Low Temperature Soldering Process using Vapor phase</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565107&Exemplar=1&LAN=DE A1 Kim, Youngja A1 Choi, Woojin A1 Oh, Seungyeop A1 Lee, Sinyeop A1 Kang, Sunwon YR 2024 SN 2377-5726 K1 Resistance K1 Mass production K1 Liquids K1 Limiting K1 Process control K1 Surface mount technology K1 Packaging K1 Vapor Phase Soldering K1 Warpage K1 Liquid Film K1 Condensation SP 2091 OP 2095 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00356 DO https://doi.org/10.1109/ECTC51529.2024.00356 SF ELIB - SuUB Bremen
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