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1 Ergebnisse
1
Simulation and Metrological Applications for RDL Patterning..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lee, Chang-Chun
;
Chuang, Jui-Chang
;
Yang, Chen-Tsai
... - p. 990-995 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00160
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Simulation and Metrological Applications for RDL Patterning Development of Glass Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565108&Exemplar=1&LAN=DE A1 Lee, Chang-Chun A1 Chuang, Jui-Chang A1 Yang, Chen-Tsai A1 Li, Chung-I-I A1 Lee, Shih-Hsien A1 Kuo, Shih-Hao YR 2024 SN 2377-5726 K1 Deformation K1 Lithography K1 Multichip modules K1 Glass K1 Bandwidth K1 Dielectric films K1 Optical films K1 Glass Substrate K1 Finite Element Analysis (FEA) K1 Digital Optical Method K1 Mask-less Digital Lithography SP 990 OP 995 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00160 DO https://doi.org/10.1109/ECTC51529.2024.00160 SF ELIB - SuUB Bremen
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