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1
Study for realization of the next generation high density R..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Mizutani, Masaki
;
Shelton, Douglas
;
Tokuyama, Yusuke
... - p. 293-298 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00055
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Study for realization of the next generation high density RDL packaging for 2.5D large silicon interposer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565109&Exemplar=1&LAN=DE A1 Mizutani, Masaki A1 Shelton, Douglas A1 Tokuyama, Yusuke A1 Shiozawa, Noriyuki A1 Murakami, Mizuma A1 Suda, Hiromi A1 Shinoda, Ken-Ichiro A1 Mori, Ken-Ichiro YR 2024 SN 2377-5726 K1 Performance evaluation K1 Deep learning K1 Accuracy K1 Electronic components K1 AI accelerators K1 Packaging K1 Silicon K1 advanced packaging K1 large Scale interposer K1 Silicon -Bride package substrate SP 293 OP 298 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00055 DO https://doi.org/10.1109/ECTC51529.2024.00055 SF ELIB - SuUB Bremen
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