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1 Ergebnisse
1
Advanced Bonding Process based on Intense Pulsed Light Irra..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Ryu, Seong-Ung
;
Park, Jong-Whi
;
Ju, Young-Min
. - p. 2218-2222 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00377
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Advanced Bonding Process based on Intense Pulsed Light Irradiation for Solder Bump in Flip-Chip Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565112&Exemplar=1&LAN=DE A1 Ryu, Seong-Ung A1 Park, Jong-Whi A1 Ju, Young-Min A1 Kim, Hak-Sung YR 2024 SN 2377-5726 K1 Scanning electron microscopy K1 Radiation effects K1 Force K1 Packaging K1 Flip-chip devices K1 Compounds K1 Intermetallic K1 Intense pulsed light K1 Solder bump K1 SAC305 K1 Ultrafast bonding process K1 Flip-chip K1 Shear force K1 Intermetallic compounds SP 2218 OP 2222 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00377 DO https://doi.org/10.1109/ECTC51529.2024.00377 SF ELIB - SuUB Bremen
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