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Modeling of Copper Hybrid Bonding Anneal:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Hooge, Joshua
;
Jois, Chetan
;
Netzband, Christopher
. - p. 1231-1235 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00199
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Modeling of Copper Hybrid Bonding Anneal</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565113&Exemplar=1&LAN=DE A1 Hooge, Joshua A1 Jois, Chetan A1 Netzband, Christopher A1 Son, Ilseok YR 2024 SN 2377-5726 K1 Adaptation models K1 Thermal expansion K1 Transmission electron microscopy K1 Surface morphology K1 Mathematical models K1 Dielectrics K1 Copper K1 copper hybrid bonding K1 surface diffusion K1 3DI K1 phase field SP 1231 OP 1235 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00199 DO https://doi.org/10.1109/ECTC51529.2024.00199 SF ELIB - SuUB Bremen
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