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1 Ergebnisse
1
Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lee, Ou-Hsiang
;
Chiu, Wei-Lan
;
Chang, Hsiang-Hung
... - p. 1863-1867 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00312
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding with Tailored CMP Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565115&Exemplar=1&LAN=DE A1 Lee, Ou-Hsiang A1 Chiu, Wei-Lan A1 Chang, Hsiang-Hung A1 Chiang, Chia-Wen A1 Yu, Shih-Cheng A1 Yang, Tsung-Yu Ou A1 Hsiao, Su-Ching A1 Ko, Ting-Yu A1 Lin, Yu-Min A1 Wang, Chin-Hung A1 Lo, Wei-Chung A1 Lee, Chia-Hsin A1 Tan, Chung-An A1 Fowler, Michelle A1 Lubbers, Maycie YR 2024 SN 2377-5726 K1 Grain size K1 Temperature K1 Morphology K1 Electronic components K1 Materials reliability K1 Packaging K1 Electric variables K1 nanocrystalline copper K1 3DIC K1 CMP K1 Cu Pad K1 low-temperature bonding K1 polymer hybrid bonding SP 1863 OP 1867 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00312 DO https://doi.org/10.1109/ECTC51529.2024.00312 SF ELIB - SuUB Bremen
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