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1 Ergebnisse
1
Transcending the Reticle Limit in On-Wafer Die Integration ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Byambadorj, Tsenguun
;
Ceballos, Andrew C.
;
MacWilliams, Kenneth P.
... - p. 11-15 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00010
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
Transcending the Reticle Limit in On-Wafer Die Integration and Advanced Packaging: Full-Wafer Patterning with High-Productivity Electron Beam Lithography
UL https://suche.suub.uni-bremen.de/peid=ieee-10565118&Exemplar=1&LAN=DE A1 Byambadorj, Tsenguun A1 Ceballos, Andrew C. A1 MacWilliams, Kenneth P. A1 Prescop, Ted A. A1 Lam, David K. A1 Michalka, Timothy L. A1 Bishop, Craig A1 Sandstrom, Cliff A1 Olson, Tim YR 2024 SN 2377-5726 K1 Productivity K1 Technological innovation K1 Electron beams K1 Scalability K1 High performance computing K1 Lithography K1 Integrated circuit interconnections K1 multicolumn electron beam lithography (MEBL) K1 adaptive packaging K1 integration K1 maskless/direct-write K1 high-resolution K1 high-productivity SP 11 OP 15 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00010 DO https://doi.org/10.1109/ECTC51529.2024.00010 SF ELIB - SuUB Bremen
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