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Transcending the Reticle Limit in On-Wafer Die Integration ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Byambadorj, Tsenguun ; Ceballos, Andrew C. ; MacWilliams, Kenneth P.... - p. 11-15 , 2024

Link: https://doi.org/10.1109/ECTC51529.2024.00010

RT 
T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Transcending the Reticle Limit in On-Wafer Die Integration and Advanced Packaging: Full-Wafer Patterning with High-Productivity Electron Beam Lithography</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10565118&Exemplar=1&LAN=DE
				
A1 Byambadorj, Tsenguun
A1 Ceballos, Andrew C.
A1 MacWilliams, Kenneth P.
A1 Prescop, Ted A.
A1 Lam, David K.
A1 Michalka, Timothy L.
A1 Bishop, Craig
A1 Sandstrom, Cliff
A1 Olson, Tim
YR 2024
SN 2377-5726
K1 Productivity
K1 Technological innovation
K1 Electron beams
K1 Scalability
K1 High performance computing
K1 Lithography
K1 Integrated circuit interconnections
K1 multicolumn electron beam lithography (MEBL)
K1 adaptive packaging
K1 integration
K1 maskless/direct-write
K1 high-resolution
K1 high-productivity
SP 11
OP 15
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00010
DO https://doi.org/10.1109/ECTC51529.2024.00010
SF ELIB - SuUB Bremen

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