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1 Ergebnisse
1
A robust mesh size control technology suitable for various ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Chiang, Kuo-Ning
;
Lee, C. E.
;
Yuan, Cadmus
- p. 234-239 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00045
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A robust mesh size control technology suitable for various empirical equations for predicting solder joint reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565119&Exemplar=1&LAN=DE A1 Chiang, Kuo-Ning A1 Lee, C. E. A1 Yuan, Cadmus YR 2024 SN 2377-5726 K1 Simulation K1 Semiconductor device reliability K1 Mathematical models K1 Finite element analysis K1 Wafer scale integration K1 Thermal analysis K1 Size control K1 Wafer-Level Packaging K1 Accelerated Thermal Cycle Test K1 Finite Element Method K1 MTTF K1 Coffin-Manson equation K1 Modified Energy Density Method SP 234 OP 239 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00045 DO https://doi.org/10.1109/ECTC51529.2024.00045 SF ELIB - SuUB Bremen
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