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Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Cheemalamarri, Hemanth Kumar
;
Sundaram, Arvind
;
Sandra, San
... - p. 803-808 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00390
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565120&Exemplar=1&LAN=DE A1 Cheemalamarri, Hemanth Kumar A1 Sundaram, Arvind A1 Sandra, San A1 Van Nhat Anh, Tran A1 Chandra Rao, Bhesetti A1 Guan, Chen Gim A1 Haitao, Yu A1 Raju, Mani A1 Ping, Luo A1 Chaeeun, Lee A1 Rao, Vempati Srinivasa A1 Singh, Navab YR 2024 SN 2377-5726 K1 Wafer bonding K1 Three-dimensional displays K1 Planarization K1 Lithography K1 Plating K1 Dielectrics K1 Bonding K1 Cu/dielectric hybrid bonding K1 Fine-pitch K1 Dielectric stack SP 803 OP 808 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00390 DO https://doi.org/10.1109/ECTC51529.2024.00390 SF ELIB - SuUB Bremen
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