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1 Ergebnisse
1
One-step Surface Modification for Boron Nitride and its Pol..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lin, Zihao
;
Li, Jiaxiong
;
Sun, Zhijian
... - p. 2003-2007 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00341
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>One-step Surface Modification for Boron Nitride and its Polymer Composite of Enhanced Thermal Conductivity for Advanced Packaging Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565128&Exemplar=1&LAN=DE A1 Lin, Zihao A1 Li, Jiaxiong A1 Sun, Zhijian A1 Fang, Andrew D. A1 Moon, Kyoung-Sik A1 Wong, Ching-Ping YR 2024 SN 2377-5726 K1 Boron K1 Thermal resistance K1 Loading K1 Packaging K1 Conductivity K1 Thermal conductivity K1 Electronic packaging thermal management K1 thermal management K1 boron nitride K1 BN surface functionalization K1 thermal conductivity K1 epoxy compounds SP 2003 OP 2007 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00341 DO https://doi.org/10.1109/ECTC51529.2024.00341 SF ELIB - SuUB Bremen
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