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1 Ergebnisse
1
Development of New Concept Photo Imageable Dielectric Mater..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Sato, Kazuki
;
Ebisawa, Kazuaki
;
Irie, Makiko
.. - p. 876-880 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00142
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Development of New Concept Photo Imageable Dielectric Materials for Next-Generation Advanced Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565129&Exemplar=1&LAN=DE A1 Sato, Kazuki A1 Ebisawa, Kazuaki A1 Irie, Makiko A1 Kubo, Atsushi A1 Shimizu, Takashi YR 2024 SN 2377-5726 K1 Temperature K1 Image resolution K1 Lithography K1 Dielectric losses K1 Polyimides K1 Packaging K1 Nonhomogeneous media K1 polyimide K1 photosensitive K1 shrinkage K1 Df K1 resolution SP 876 OP 880 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00142 DO https://doi.org/10.1109/ECTC51529.2024.00142 SF ELIB - SuUB Bremen
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