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1 Ergebnisse
1
RF modelling and characterization of TSVs and inductive lin..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Sun, Xiao
;
Su, Chin-Ya
;
chen, Shih-Hung
... - p. 754-759 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00123
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>RF modelling and characterization of TSVs and inductive links of hybrid bonded devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565131&Exemplar=1&LAN=DE A1 Sun, Xiao A1 Su, Chin-Ya A1 chen, Shih-Hung A1 chew, Soon Aik A1 Zhang, Boyao A1 Beyne, Eric YR 2024 SN 2377-5726 K1 Semiconductor device modeling K1 Wireless communication K1 Performance evaluation K1 Couplings K1 Noise K1 Electrostatic discharges K1 Inductors K1 Hybrid bonding K1 TSVs K1 inductive coupling K1 non-contactprobing SP 754 OP 759 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00123 DO https://doi.org/10.1109/ECTC51529.2024.00123 SF ELIB - SuUB Bremen
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