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1 Ergebnisse
1
Ultra-thin Double Side SiP Technology with Embedded Trace S..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Li, Jerry Che-Han
;
Belonio, Jesus Mennen
;
Tang, Humi Shih-Wen
. - p. 1277-1281 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00207
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Ultra-thin Double Side SiP Technology with Embedded Trace Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565132&Exemplar=1&LAN=DE A1 Li, Jerry Che-Han A1 Belonio, Jesus Mennen A1 Tang, Humi Shih-Wen A1 Wei, Jessie Yu-Shan YR 2024 SN 2377-5726 K1 Three-dimensional displays K1 Surface emitting lasers K1 Laser ablation K1 Internet of Things K1 Surface finishing K1 Surface cracks K1 Wearable devices K1 Double Side Package K1 SiP (System in Package) K1 Heterogeneous Integration K1 Ultra-Thin Package K1 ENIG surface SP 1277 OP 1281 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00207 DO https://doi.org/10.1109/ECTC51529.2024.00207 SF ELIB - SuUB Bremen
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