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Study of Damage Development in Under-Bump Interconnects by ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Mendoza, Jorge ; Kim, Choong-Un ; Lin, Hung-Yun - p. 1644-1648 , 2024
Link: https://doi.org/10.1109/ECTC51529.2024.00272