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A novel plasma etching technology of RIE-lag free TSV and d..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Suzuki, Taichi
;
Doi, Kenta
;
Nakamura, Toshiyuki
. - p. 1934-1939 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00328
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A novel plasma etching technology of RIE-lag free TSV and dicing processes for 3D chiplets interconnect</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565140&Exemplar=1&LAN=DE A1 Suzuki, Taichi A1 Doi, Kenta A1 Nakamura, Toshiyuki A1 Morikawa, Yasuhiro YR 2024 SN 2377-5726 K1 Fabrication K1 Three-dimensional displays K1 Stacking K1 Etching K1 Plasmas K1 Reliability K1 Logic K1 Dual-frequency ICP K1 TSV K1 Non-Bosch etch K1 Plasma dicing K1 RIE-lag free etch SP 1934 OP 1939 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00328 DO https://doi.org/10.1109/ECTC51529.2024.00328 SF ELIB - SuUB Bremen
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