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1 Ergebnisse
1
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Horibe, Akihiro
;
Watanabe, Takahito
;
Marushima, Chinami
... - p. 269-273 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00051
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565142&Exemplar=1&LAN=DE A1 Horibe, Akihiro A1 Watanabe, Takahito A1 Marushima, Chinami A1 Kohara, Sayuri A1 Yamada, Yasuharu A1 Mori, Hiroyuki A1 Taneja, Divya A1 Pilger, Katherine A1 Jacques-Fortin, Alexis A1 Godard, Maxime A1 Chen, Qianwen A1 Perfecto, Eric A1 Jain, Aakrati A1 Ross, Joseph R A1 Wassick, Thomas A1 De Sousa, Isabel YR 2024 SN 2377-5726 K1 Bridges K1 Semiconductor device reliability K1 Thermomechanical processes K1 Silicon K1 Manufacturing K1 Laminates K1 Soldering K1 chiplet K1 silicon bridge K1 fine pitch solder joint K1 flip chip package SP 269 OP 273 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00051 DO https://doi.org/10.1109/ECTC51529.2024.00051 SF ELIB - SuUB Bremen
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